Beyond Liquid Cooling: Boyd Strengthens AI Cooling Innovation Capabilities with Durbin Group Acquisition

Boyd Acquires the Durbin Group to Enhance its Liquid Cooling System Technology Portfolio with Advanced Two-Phase Liquid Cooling Capabilities that Address Thermal Requirements of Next-Generation AI Processors

NEW YORK--(BUSINESS WIRE)--Boyd’s latest acquisition, the Durbin Group, strengthens Boyd’s innovation capabilities in liquid cooling system technologies critical for high-performance compute, artificial intelligence (AI), and advanced data centers. Boyd has solved thermal challenges in data centers since the advent of microprocessors. Boyd’s latest thermal innovations in liquid cooling have helped our customers accelerate their rapid transition from traditional air cooled to liquid cooled racks. Boyd has extensive liquid system design experience having shipped over 40 thousand liquid cooling systems to high-performance compute, hyperscaler, and semiconductor customers. Boyd also designs and manufactures liquid cold plates which cool processors and complement the liquid cooling system. To date, Boyd has shipped to key enterprise customers over 4 million liquid cold plates incorporated into 1 million liquid loops.

The Durbin Group has a long, trusted history designing advanced liquid cooling systems for enterprise, aerospace, and defense markets. These systems cool high-performance compute, power conversion, and directed energy applications. The latest AI, defense, and data center applications require single-phase liquid cooling technology, but next-generation designs require even more sophisticated two-phase liquid cooling technologies. The Durbin Group’s expertise and heritage in single and two-phase liquid cooling systems will enhance Boyd’s development efforts to address current and next-generation thermal management needs.

“We’re investing in strong engineering talent to expand Boyd’s liquid system design capacity and accelerate our liquid cooling system development. Significant market growth in high-performance data centers and artificial intelligence will continue for the foreseeable future, and this demand requires liquid cooling to scale,” said Boyd CEO Doug Britt. “We are a global leader in the design and manufacturing of liquid systems, cold plates and liquid cooling loops that directly cool high-power microprocessors. Our liquid cooling systems have cooled high-reliability semiconductor, defense, and medical applications for decades. We are well positioned to deliver complete, optimized, leak-free liquid cooling systems to AI customers at scale.”

About Boyd

Boyd is the trusted global innovator of sustainable solutions that make our customers’ products better, safer, faster, and more reliable. Our innovative engineered materials and thermal solutions advance our customers’ technology to maximize performance in the world’s most advanced data centers; enhance reliability and extend range for electric and autonomous vehicles; advance the accuracy of cutting-edge personal healthcare and diagnostic systems; enable performance-critical aircraft and defense technologies; and accelerate innovation in next-generation electronics and human-machine-interface. Core to Boyd’s global manufacturing is a deep commitment to protect the environment with sustainable, scalable, lean, strategically located regional operations that reduce waste and minimize carbon footprint.​ We empower our employees, develop their potential, and inspire them to do the right things with integrity and accountability to champion our customers’ success.

Visit us at www.boydcorp.com.