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阿布達比科技創新研究院 (TII) 和NVIDIA共同成立中東第一座專門從事人工智慧與機器人研究的NVAITC聯合實驗室

阿拉伯聯合大公國,阿布達比--(BUSINESS WIRE)--(美國商業資訊)-- 隸屬阿布達比高級科技研究委員會 (ATRC) 的應用研究機構「科技創新研究院」 (The Technology Innovation Institute, TII) 與高速運算及人工智慧科技的世界先驅NVIDIA聯手合作,成立中東第一座專門從事人工智慧與機器人研究的聯合實驗室。這項破天荒的合作計畫將在該地成立第一座開發下一代人工智慧模型、機器人平台和人形機器人技術的研究中心,加速整個產業的創新。 成立科技創新研究院-NVAITC(NVIDIA人工智慧技術中心)人工智慧與機器人聯合實驗室的消息在於科技創新研究院阿布達比總部進行的簽約儀式上宣布,兩大機構的多位資深主管列席這場儀式。這份合約由科技創新研究院執行長Najwa Aaraj博士和NVIDIA的META地區企業區域總監Marc Domenech共同簽署,並有ATRC總幹事Shahab Abu Shahab殿下、ATRC支援服務執行董事Abdulaziz Al Dosari殿下、NVIDIA的HPC/超級運算銷售與業務開發全球副總裁John Jose...
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阿布扎比TII与NVIDIA启动中东首个“人工智能与机器人”NVAITC联合研究实验室

阿布扎比,阿拉伯联合酋长国--(BUSINESS WIRE)--(美国商业资讯)-- 阿布扎比先进技术研究委员会(ATRC)的应用研究机构——技术创新研究院(TII),与全球加速计算和人工智能领导者NVIDIA强强联手,共同创立中东首个专注于人工智能与机器人技术的联合实验室。这一里程碑式的合作将在该地区打造前所未有的创新中心,致力于开发下一代人工智能模型、机器人平台及人形机器人技术,加速各行各业的创新。 TII-NVAITC(NVIDIA人工智能技术中心)人工智能与机器人联合实验室签约仪式在TII阿布扎比总部举行,双方高层代表共同见证这一重要时刻。TII首席执行官Najwa Aaraj博士与NVIDIA中东、土耳其和非洲地区企业业务区域总监Marc Domenech签署合作协议,ATRC总干事Shahab Abu Shahab阁下、ATRC支持服务执行董事Abdulaziz Al Dosari阁下、NVIDIA HPC/超级计算销售与业务发展全球副总裁John Josephakis、NVIDIA全球人工智能技术中心主管Simon See等嘉宾共同出席,本次合作标志着阿联酋人工智能与机器...
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Samenvatting: Infobip en Oracle werken samen om klantgesprekken te transformeren met WhatsApp- en sms-integratie

VODNJAN, Kroatië--(BUSINESS WIRE)--Infobip, een wereldwijd cloudcommunicatieplatform en partner van Oracle, en Oracle hebben de mogelijkheden van Oracle Fusion Cloud Service uitgebreid met de directe integratie van WhatsApp en sms-berichten. Met de integratie die beschikbaar is op Oracle Cloud Marketplace kunnen bedrijven rijkere, interactievere klantervaringen te leveren door klanten te betrekken bij populaire berichtkanalen. Omdat klanten steeds meer directe, persoonlijke interacties verwacht...
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Solidigm Introduces World’s First Cold-Plate-Cooled eSSD for Next-Generation Fanless Server Designs

RANCHO CORDOVA, Calif.--(BUSINESS WIRE)--Solidigm, a pioneer in enterprise data storage, today introduces the only Cold-Plate-Cooled enterprise SSD (eSSD) for fanless server environments. The industry’s first eSSD with single-sided direct-to-chip liquid cooling technology, the SolidigmTM D7-PS1010 E1.S SSD is one of the fastest PCIe 5.0 SSD on the planet for Direct Attach Storage (DAS) AI workloads.1 “Solidigm’s Cold-Plate-Cooled eSSD is a breakthrough for thermal optimization, unlocking tremen...
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Terray Therapeutics Expands Board of Directors with Appointment of Biotechnology Leader Wendy Young, Ph.D.

LOS ANGELES--(BUSINESS WIRE)--Biotechnology executive and scientist, Wendy Young Ph.D., joins the Terray Board....
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UDT Continues Rapid Acceleration of Growth in Lone Star State with Recently Awarded Texas Department of Information Resources Contract

MIRAMAR, Fla.--(BUSINESS WIRE)--UDT (United Data Technologies), a national technology solutions leader focused on delivering enterprise IT and telecommunication solutions, announced today the latest evidence of their rapid growth in Texas. A contract awarded by the Texas Department of Information Resources (DIR) will allow UDT to more easily provide information technology products and related services to public education institutions and state and local governments through DIR’s Cooperative Con...
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Bridge Defense Integrates Federated IT, Expands Software and Edge Compute Offerings

WASHINGTON--(BUSINESS WIRE)--Bridge Defense integrates Federated IT, expanding secure IT, software, analytics, and edge computing solutions for defense and federal missions....
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CORSAIR Expands Popular Modular PC Case Line With Wraparound Panoramic Glass FRAME 4500X

MILPITAS, Calif.--(BUSINESS WIRE)--CORSAIR today announced availability of its new FRAME 4500X, a showstopper case for high-end PC builds, boasting an enhanced chassis design with panoramic glass, curved panels, and modularity. This reflects Corsair’s ongoing innovation in the premium PC segment, and a deliberate strategy to deepen its ecosystem and raise attach-rates. The FRAME 4500X is a significant expansion of the Company’s earlier FRAME Modular Case System to a larger, even more feature-ri...
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StratEdge Highlights High-Performance Packaging at IMAPS and BCICTS

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge to showcase high-performance GaN, GaAs & SiC packages at IMAPS (Booth 719) and BCICTS (Booth 6) this fall....
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From the First Tee to Final Roar, T-Mobile Supercharges the Ryder Cup with 5G

BELLEVUE, Wash.--(BUSINESS WIRE)--From the first ticket scanned at Bethpage Black to the winning team hoisting the Ryder Cup trophy, T-Mobile 5G is connecting one of golf’s biggest events like never before. Today, in partnership with the PGA of America, T-Mobile (NASDAQ: TMUS) announced all the ways it’s turning the Ryder Cup into the most connected, immersive and energetic competition yet — all powered by the speed and scale of T-Mobile 5G. As the Exclusive 5G Network of the PGA of America, T-...