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TOKYO--(BUSINESS WIRE)--Rigaku Corporation, a global solution partner in X-ray analytical technologies and a Group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has increased its capacity for production of semiconductor process control instruments at its own plant in Takatsuki, Osaka Prefecture and at the facilities of a partner company* in Nirasaki, Yamanashi Prefecture. * 6th factory of Nippo Precision Co., Ltd. Against a backg...

FREMONT, Calif., & CLEARWATER, Fla.--(BUSINESS WIRE)--TD SYNNEX (NYSE:SNX), a leading global distributor and solutions aggregator for the IT ecosystem, has been recognized by Dell Technologies in multiple regions with 2025 Partner of the Year awards honoring its sustainability commitments, marketing excellence and the strength of its business partnership. The company was recognized as Dell Technologies’ 2025 EMEA Distributor of the Year, marking the second consecutive year TD SYNNEX has earned...

MORRISVILLE, N.C.--(BUSINESS WIRE)--Lenovo has been positioned in the Major Players Category in the IDC MarketScape: Worldwide Hybrid IT Infrastructure Consulting and Integration Services 2025 Vendor Assessment.* According to the report, “Lenovo has significantly invested in its portfolio globally over the past three or more years, with a focus on continuing to build services that accelerate its customers' hybrid cloud, multicloud, and AI cloud initiatives.” And: “Lenovo's investments in the co...

IRVINE, Calif.--(BUSINESS WIRE)--Mobix Labs, Inc. (Nasdaq: MOBX) (“Mobix”) today announced an unsolicited, non-binding proposal to acquire Peraso, Inc. (Nasdaq: PRSO) (“Peraso”) in a premium stock-for-stock transaction. Under the proposed terms, Mobix will exchange newly issued MOBX common shares for each PRSO share at a 20% premium to Peraso’s 30-day average closing share price through June 10, 2025. Transaction Highlights & Shareholder Benefits Revenue Accretion & Scale: Peraso Q1 202...

MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Aeva® (Nasdaq: AEVA), a leader in next-generation sensing and perception systems, today announced that it will host its “Aeva Day: Beyond the Beam” event on July 31, 2025, live in New York City and online. The event will bring together customers, investors, media, and industry partners for a deep dive into Aeva’s breakthrough Frequency Modulated Continuous Wave (FMCW) perception technology platform, momentum with key customers, and Aeva’s long-term vision...

WEST WARWICK, R.I.--(BUSINESS WIRE)--AstroNova, Inc. (Nasdaq: ALOT) Made Good Faith Effort to Resolve Costly, Disruptive Proxy Contest in Collaborative and Amicable Manner...

SHANGHAI--(BUSINESS WIRE)--VeriSilicon (688521.SH) hat heute die IP-Cores der ZSP5000-Serie für die digitale Signalverarbeitung (DSP) vorgestellt, die auf der bewährten DSP-Architektur der fünften Generation aufbauen. Diese Produktreihe bietet ein leicht skalierbares und energieeffizientes Design und wurde insbesondere für rechenintensive Workloads wie Computer Vision und eingebettete KI optimiert. Zusammen mit der konfigurierbaren Architektur bietet diese IP-Serie exzellente Lösungen mit hoher...

SHANGHÁI--(BUSINESS WIRE)--VeriSilicon (688521.SH) acaba de lanzar la serie de IP de procesamiento digital de señales (Digital Signal Processing, DSP) ZSP5000, basada en su arquitectura DSP de quinta generación probada en silicio. Esta línea de productos utiliza un diseño altamente escalable y eficiente desde el punto de vista energético, y se ha optimizado notablemente para cargas de trabajo de cálculo intensivo como la visión por computadora y la IA integrada. Combinada con su arquitectura co...

上海--(BUSINESS WIRE)--（ビジネスワイヤ） -- ベリシリコン（688521.SH）は、第5世代シリコン実証済みDSPアーキテクチャに基づく「ZSP5000」デジタル信号処理（DSP）シリーズIP（設計資産）の提供を開始したと発表しました。本製品群は、高いスケーラビリティとエネルギー効率に優れた設計を採用し、コンピュータビジョンや組み込みAIといった計算集約型ワークロード向けに高度に最適化されています。アーキテクチャの構成可能な特性と相まって、さまざまなエッジデバイスにおいて、消費電力と演算性能の両面で優れたソリューションを提供します。 ZSP5000シリーズIPには、ZSP5000、ZSP5000UL、ZSP5000L、ZSP5000Hが含まれ、8ビットの乗算加算（MAC）演算を1サイクルあたり32回から最大256回までスケーラブルに処理するベクトル演算性能を実現します。より高い演算性能を必要とする場合には、ZSP5000Hコアを複数組み合わせたマルチクラスタ構成を採用したマルチコアDSP「ZSP5400H」を提供可能です。 ZSP5000シリーズは、直感的で豊富...

中國上海--(BUSINESS WIRE)--(美國商業資訊)-- (美國商業資訊)--芯原股份（芯原，股票代號：688521.SH）今日正式發表ZSP5000系列IP。該產品線以公司第五代經矽驗證的數位訊號處理器（DSP）架構為基礎，採用高可擴充性和低功耗的設計，並針對電腦視覺、內建式人工智慧等運算密集型應用進行了深度最佳化，結合架構的可設定能力，該系列IP可為各類邊緣裝置提供兼具能效優勢和運算效率的優秀解決方案。 ZSP5000系列包含ZSP5000、ZSP5000UL、ZSP5000L及ZSP5000H等IP，提供每週期32至256次8位乘積累加運算（MAC）的可擴充向量處理能力。針對更高的效能需求，芯原採用多核架構的ZSP5400H還可透過整合多個ZSP5000H內核來進一步提升運算能力。 ZSP5000系列IP具有豐富且直覺式的指令集，該指令集經過最佳化，可提高程式設計的便利性並支援高效的效能調優。其專用指令可加快常見的影像和訊號處理任務，包括向量與標量運算、水準歸約、排列、移位、查表、限幅及均值運算。ZSP5000系列IP還整合了ZTurbo輔助處理器介面，便於客戶在同一流...